d3 Initiative Projects

Japanese

The Future Society Initiative (FSI) promotes educational and research projects in the field of advanced semiconductor (data, design, and device) research.
The number of registered projects is 17 as of 2024-4-1. See this portal page for information on how to register your project (on-campus access only).

1. Advanced Data System
1.1 Data Processing System (Novel Computing, Machine Learning, Neural Network, etc.)
1.2 Data Storage System (Computation-in-Memory, Persistent Memory, etc.)
1.3 Data Communication System (5G, Beyond 5G, IoT, Data Free Flow with Trust, etc.)
1.4 Data Generation System (Sensor, Microsensor, etc.)
1.5 Data Display System (VR, AR, MR, SR, etc.)
1.6 Data-Driven System (Service, Engineering, Science, etc.)
2. Advanced Design
2.1 Electronic Design Automation (Agile Development, High-Level Synthesis, etc.)
2.2 Emulation/Prototyping (FPGA, etc.)
2.3 Co-Design (HW/SW Co-Design, Design/Verification Co-Design, etc.)
2.4 Architecture (Computer architecture, Communication architecture, Processor, etc.)
2.5 Design for Low Energy (Power/Energy Efficiency, Power Delivery, Heat Removal, etc.)
2.6 3D Design (3D Integration, 3D Implementation, 3D Module, etc.)
3. Advanced Device/Material
3.1 Data Processing Device/Material (Scaled CMOS, Novel Switch, 3D Integration, etc.)
3.2 Data Storage Device/Material (Novel Memory, 3D-Stacked Memory, etc.)
3.3 Data Communication Device/Material (HF Device, IoT Device, etc.)
3.4 Data Generation Device/Material (Novel Sensor Device, etc.)
3.5 Data Display Device/Material (Novel Display Device, etc.)
3.6 Data-Driven Device/Material (Data-Driven Lithography, Manufacturing Equipment, Process, etc.)
3.7 Advanced Device/Material Evaluation Measurement Techniques (SEM, AFM, OCD, TEM, etc.)

white:main category , blue:category1 , red:category2 , green:category3

Access Map
Close
Kashiwa Campus
Close
Hongo Campus
Close
Komaba Campus
Close