This is a summer program organized by the University of Hong Kong (HKU) which combines 5 days of lectures in English at HKU and six weeks of industrial internship (in Shanghai). Half of the participants will be students from HKU, while the remainder are students selected from the most prestigious universities from around the world (in the past students have come from Princeton, Yale, Oxford, etc.). Main part of the expenses (e.g. tuition fees, accommodation, return airfare between Hong Kong and an internship site) will be provided by the support from The Victor and William Fung Foundation.
June 29 - August 14, 2020 (may be subject to slight changes)
China/Hong Kong and Shanghai
Three undergraduate students
Tuition, accommodation fees, and return airfare between Hong Kong and an internship site (mainland China) will also be covered by the Victor and William Fung Foundation. However, the following are the responsibility of each individual participant: Return airfare (between the students home country and Hong Kong), meals and local transportation, application for visa to China, miscellaneous and personal expenses. Check the program website for more information.
A scholarship called “The Fung Scholarships” with a value of JPY 140,000 will be provided by a donation from the Victor and William Fung Foundation.
Confirmation of notification for applying Study Abroad Programs Administered by the Division for Global Campus Initiatives, The University of Tokyo
Confirmation of Intention to Receive Scholarship
Apply from the "Study Abroad" tab on the Academic Affairs System website (UTAS, ITC-LMS). (Please read the Application Guidelines carefully).
Reports of past participants are available in the past students’ reports page.